Laser cutting apparatus and laser cutting method
US8093530B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2005 |
| Grant date | Jan 10, 2012 |
| Priority date | — |
| Expiry date | Jan 11, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser cutting apparatus and a laser cutting method are provided which are adapted to concentrate laser light into a silicon substrate to produce a plurality of internal cracks. A light concentrating position, to which laser beams included in the laser light are concentrated, is temporally and spatially displaced to appropriately change lengths of the cracks according to positions in a direction of depth of the substrate. Consequently, the lengths of the internal cracks are controlled to surely lead a crack opening, the starting point of which is the internal crack formed by laser processing, to a predetermined cutting line on a surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.