System-in-package with fan-out WLCSP
US8093722B2 · kind B2 · utility
46Cited by
20References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2010 |
| Grant date | Jan 10, 2012 |
| Priority date | — |
| Expiry date | Oct 15, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system-in-package includes a package carrier; a first semiconductor die having a die face and a die edge, the first semiconductor die being assembled face-down to a chip side of the package carrier; a second semiconductor die mounted alongside of the first semiconductor die; a rewiring laminate structure comprising a re-routed metal layer between the first semiconductor die and the package carrier. At least a portion of the re-routed metal layer projects beyond the die edge. A plurality of bumps are arranged on the rewiring laminate structure for electrically connecting the first semiconductor die with the package carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.