Electrically conductive interconnect system and method
US8093729B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 16, 2007 |
| Grant date | Jan 10, 2012 |
| Priority date | — |
| Expiry date | Nov 7, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24174
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrically conductive interconnect system has a post, extending above a supporting surface, the post including a rigid material, a coating on the rigid material, wherein the post and has a first width at the supporting surface and a second width at a distance removed from the supporting surface, and the post narrows from the first width to the second width. A method of electrically connecting a portion of a first supporting surface to a portion of a second supporting surface involves bringing a post on the first supporting surface into contact with an electrically conductive material located on the second supporting surface, softening the electrically conductive material, causing a separation distance between the first supporting surface and the second supporting distance to decrease so that a portion of the post will be surrounded by the electrically conductive material, and allowing the temperature of the electrically conductive material to decrease.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.