Polishing pad
US8094456B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2007 |
| Grant date | Jan 10, 2012 |
| Priority date | — |
| Expiry date | May 20, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
To provide a polishing pad which is insusceptible to clogging of groove with abrasive particles and grinding dusts during polishing, and leads to little decrease in polishing rate even after long-term continuous use. A polishing pad of the present invention has a polishing layer formed of polyurethane resin foam having fine-cells, and asperity structure formed in a polishing surface of the polishing layer, and is featured in that the polyurethane resin foam is a reaction cured product between isocyanate-terminated prepolymer containing high-molecular-weight polyol component and isocyanate component, and a chain extender, and contains a silicon-based surfactant having combustion residue of not less than 8 wt %.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.