Methods for cleaning process kits and chambers, and for ruthenium recovery
US8097089B2 · kind B2 · utility
0Cited by
14References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2008 |
| Grant date | Jan 17, 2012 |
| Priority date | — |
| Expiry date | May 19, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/564
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method is provided for recovering a metal from electronic device deposition equipment including: providing deposition equipment wherein the deposition equipment is at least partially coated with a deposited metal; blasting the deposition equipment with a grit to remove at least some of the deposited metal to form a blasted grit and a removed metal; and separating at least some of the removed metal from the blasted grit to form a recovered metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.