Method of production of a contact structure
US8097475B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2010 |
| Grant date | Jan 17, 2012 |
| Priority date | — |
| Expiry date | Jun 18, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probe card having a plurality of silicon finger contactors contacting pads provided on a tested semiconductor wafer and a probe board mounting the plurality of silicon finger contactors on its surface, wherein each silicon finger contactor has a base part on which a step difference is formed, a support part with a rear end side provided at the base part and with a front end side sticking out from the base part, and a conductive part formed on the surface of the support part, each silicon finger contactor mounted on the probe board so that an angle part of the step difference formed on the base part contacts the surface of the probe board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.