Printed circuit board and method of manufacturing the same
US8097814B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 20, 2009 |
| Grant date | Jan 17, 2012 |
| Priority date | — |
| Expiry date | Sep 4, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49162
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A mounting region is provided at an approximately center of one surface of an insulating layer. A conductive trace is formed so as to outwardly extend from inside of the mounting region. A cover insulating layer is formed in the periphery of the mounting region so as to cover the conductive trace. A terminal of the conductive trace is arranged in the mounting region, and a bump of an electronic component is bonded to the terminal. A metal layer made of copper, for example, is provided on the other surface of the insulating layer. A slit is formed in the metal layer so as to cross a region being opposite to the electronic component and to divide the metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.