Patent · US Active

Interconnect structures and methods

US8097955B2 · kind B2 · utility

12Cited by

1References

14Claims

0Family size

Assignee

Qimonda AG · DE

Inventors

Bernd Zimmermann · Rodenberg, DE
Volker Berghof · Dresden, DE
Stefan Ruckmich · Berlin, DE
Thorsten Schedel · Dresden, DE

Key dates

Filing date	Oct 15, 2008
Grant date	Jan 17, 2012
Priority date	—
Expiry date	Sep 29, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2225/06541
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Interconnect structures and methods are disclosed. In one embodiment, an interconnect structure includes a via extendable through a workpiece from a first side of the workpiece to a second side of the workpiece. The via is partially filled with a conductive material and has sidewalls. The interconnect structure includes a contact coupled to the conductive material in the via proximate the first side of the workpiece. The conductive material in the via comprises a recessed region comprising a landing zone proximate the second side of the workpiece.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.