Interchangeable connection arrays for double-sided DIMM placement
US8099687B2 · kind B2 · utility
5Cited by
8References
14Claims
0Family size
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Key dates
| Filing date | Sep 5, 2007 |
| Grant date | Jan 17, 2012 |
| Priority date | — |
| Expiry date | Sep 5, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A memory module has an array of connections. The array of connections is arranged in rows and columns such that there are first and second outer columns. Connections in the first and second outer columns can be interchanged to optimize double-side module placement on a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.