Electronic device substrate and its fabrication method, and electronic device and its fabrication method
US8101864B2 · kind B2 · utility
9Cited by
12References
7Claims
0Family size
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Key dates
| Filing date | Apr 29, 2009 |
| Grant date | Jan 24, 2012 |
| Priority date | — |
| Expiry date | Aug 20, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is mounted the electronic component, and which is provided to surround the metal electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.