System and method for compartmental shielding of stacked packages
US8102032B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 9, 2008 |
| Grant date | Jan 24, 2012 |
| Priority date | — |
| Expiry date | Jun 6, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device has a first substrate having a plurality of metal traces. At least one electronic component is electrically attached to a first surface of the first substrate. A second substrate has a plurality of metal traces and attached to the first substrate. At least one electronic component is electrically attached to a first surface of the second substrate. An RF shield is formed on the first substrate to minimizing Electro-Magnetic Interference (EMI) radiation and Radio Frequency (RF) radiation to the at least one electronic component on the first substrate to form an RF shield. A mold compound is used for encapsulating the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.