Computer-implemented methods and systems for determining different process windows for a wafer printing process for different reticle designs
US8102408B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2007 |
| Grant date | Jan 24, 2012 |
| Priority date | — |
| Expiry date | Nov 23, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F1/84
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Computer-implemented methods and systems for determining different process windows for a wafer printing process for different reticle designs are provided. One method includes generating simulated images illustrating how each of the different reticle designs will be printed on a wafer at different values of one or more parameters of the wafer printing process. The method also includes detecting defects in each of the different reticle designs using the simulated images. In addition, the method includes determining a process window for the wafer printing process for each of the different reticle designs based on results of the detecting step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.