Printed circuit board and method of manufacturing the same
US8102664B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2009 |
| Grant date | Jan 24, 2012 |
| Priority date | — |
| Expiry date | Mar 21, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49162
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A mounting region having a rectangular shape is provided at an approximately center of one surface of an insulating layer. A plurality of conductive traces are formed so as to outwardly extend from the inside of the mounting region. A cover insulating layer is formed so as to cover the plurality of conductive traces in a periphery of the mounting region. An electronic component is mounted on the insulating layer so as to overlap with the mounting region. A metal layer is provided on the other surface of the insulating layer. Openings having a rectangular shape are formed in the metal layer along a pair of longer sides and a pair of shorter sides of the mounting region. The openings are opposite to part of terminals of the plurality of conductive traces, respectively, with the insulating layer sandwiched therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.