Circuit device and method of manufacturing the same
US8102670B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 26, 2008 |
| Grant date | Jan 24, 2012 |
| Priority date | — |
| Expiry date | Jan 19, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided is a circuit device, in which circuit elements incorporated are electrically connected to each other via a lead so as to achieve both of the enhanced functionality and miniaturization. In a hybrid integrated circuit device, a first circuit board and a second circuit board are incorporated into a case member in a way that a first circuit board is overlaid with a second circuit board. A first circuit element is arranged on the upper face of the first circuit board and a second circuit element is arranged on the upper face of the second circuit board. Leads provided in the hybrid integrated circuit device include a lead connected only to the first circuit element mounted on the first circuit board, a lead connected only to the second circuit element mounted on the second circuit board, and a lead connected to both of the first circuit element and the second circuit element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.