Brittle workpiece splitting system and brittle workpiece splitting method
US8104385B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 7, 2005 |
| Grant date | Jan 31, 2012 |
| Priority date | — |
| Expiry date | May 12, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/321
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The brittle workpiece splitting system 1 includes a substrate holding mechanism 10 for holding a substrate 51, and a processing unit 5 for splitting the substrate 51 held by the substrate holding mechanism 10 by a splitting process. The substrate holding mechanism 10 has an edge damper 12 adapted to clamp an edge part of the substrate 51 from the sides of the opposite surfaces of the edge part, and support members 19 for supporting the substrate 51 thereon at a predetermined height. The support members 19 are disposed on the side opposite the side of the edge damper 12 with respect to the intended split line 61 parallel to the edge part of the substrate 51. The edge damper 12 has an edge holder 15 on which the substrate 51 is seated, and a pressure bar 14 for pressing the substrate 51 against the edge holder 15 to hold the substrate 51 between the edge holder 15 and the pressure bar 14. Resin members 14a and 15a made of an elastic material having comparatively high rigidity are attached to parts, to be brought into contact with the substrate 51, of the pressure bar 14 and the edge holder 15, respectively. The support members 19 are made of a low-friction material to permit the hori…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.