Polishing slurries
US8105135B2 · kind B2 · utility
3Cited by
21References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2006 |
| Grant date | Jan 31, 2012 |
| Priority date | — |
| Expiry date | Oct 15, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2993
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A polishing slurry includes liquid medium and particulate abrasive. The particulate abrasive includes soft abrasive particles, hard abrasive particles, and colloidal silica particles, wherein the soft abrasive particles have a Mohs hardness of not greater than 8 and the hard abrasive particles have a Mohs hardness of not less than 8, and wherein the soft abrasive particles and the hard abrasive particles are present at a weight ratio of not less than 2:1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.