System and method of vapor deposition
US8105954B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2008 |
| Grant date | Jan 31, 2012 |
| Priority date | — |
| Expiry date | May 27, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D3/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided is a method and system for vapor deposition of a coating material onto a semiconductor substrate. In an embodiment, photoresist is deposited. An in-situ baking process may be performed with the vapor deposition. In an embodiment, a ratio of chemical components of a material to be deposited onto the substrate is changed during the deposition. Therefore, a layer having a gradient chemical component distribution may be provided. In an embodiment, a BARC layer may be provided which includes a gradient chemical component distribution providing an n,k distribution through the layer. Other materials that may be vapor deposited include pattern freezing material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.