Die package including substrate with molded device
US8106406B2 · kind B2 · utility
8Cited by
68References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2008 |
| Grant date | Jan 31, 2012 |
| Priority date | — |
| Expiry date | Jun 27, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/856
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package is disclosed. The package includes a premolded substrate having a leadframe structure, a first device attached to the leadframe structure, and a molding material covering at least part of the leadframe structure and the first device. It also includes a second device attached to the premolded substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.