Magnetic sensor integrated circuit device and method

US8106654B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Horst Theuss · Wenzenbach, DE
• Helmut Wietschorke · Laberweinting, DE

Key dates

• Filing date: May 27, 2008
• Grant date: Jan 31, 2012
• Expiry date: May 23, 2030

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R33/0005
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

An sensor includes a substrate with a magnetic field sensor mounted on the substrate. The magnetic field sensor has a first surface defining a plane. A magnetic flux conducting member has a second surface that is not parallel to the first surface. A non-magnetic member is situated between the magnetic field sensor and the magnetic flux conducting member.