Thin-film bulk acoustic resonators having perforated resonator body supports that enhance quality factor
US8106724B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2009 |
| Grant date | Jan 31, 2012 |
| Priority date | — |
| Expiry date | May 26, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2009/241
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Micro-electromechanical acoustic resonators include a substrate having a cavity therein and a resonator body suspended over the cavity. The resonator body is anchored on opposing sides thereof (by support beams) to first and second portions of the substrate. These first and second portions of the substrate, which extend over the cavity as first and second ledges, respectively, each have at least one perforation therein disposed over the cavity. These perforations may be open or filled. The first and second ledges are formed of a first material (e.g., silicon) and the first and second ledges are filled with a second material having a relatively high acoustic impedance relative to the first material. This second material may include a material selected from a group consisting of tungsten (W), copper (Cu), molybdenum (Mo).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.