Laser cutting method
US8108998B2 · kind B2 · utility
7Cited by
25References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2005 |
| Grant date | Feb 7, 2012 |
| Priority date | — |
| Expiry date | Feb 22, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
At least one exemplary embodiment is directed to a laser cutting method where a laser beam is condensed at internal points inside a substrate forming processing regions, and where the laser is swept along a cutting line, where the cutting line is associated with a recess on the substrate and where the recess can be formed contemporaneously with the formation of the processing regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.