Method to form a recess for a microfluidic device
US8110117B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2009 |
| Grant date | Feb 7, 2012 |
| Priority date | — |
| Expiry date | Dec 16, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/16
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method includes forming a recess in a first surface of a substrate, the recess having a width, depth, and height selected to correspond to a width, depth, and height of a fluid chamber, forming a sacrificial material in the recess, forming a first heater element, forming a metal layer overlying the first heater element, and forming a nozzle opening in the metal layer to expose the sacrificial material. The method also includes forming a path from a second surface of the substrate to expose the sacrificial material and removing the sacrificial material from the recess to expose the chamber with the selected width, depth, and height, the chamber in fluid communication with the path, the nozzle opening, and a surrounding environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.