Methods for detecting defect connections between metal bumps
US8113412B1 · kind B1 · utility
2Cited by
7References
20Claims
0Family size
Assignee
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Key dates
| Filing date | May 13, 2011 |
| Grant date | Feb 14, 2012 |
| Priority date | — |
| Expiry date | May 13, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/307
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method includes electrically grounding a first plurality of metal bumps on a first surface of an interconnection component to a common ground plate. A voltage contrast (VC) image of a second plurality of metal bumps of the interconnection component is generated. Grey levels of the second plurality of metal bumps in the VC image are analyzed to find defect connections between the second plurality of metal bumps and respective ones of the first plurality of metal bumps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.