Substrate supporting unit and single type substrate polishing apparatus using the same
US8113918B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2008 |
| Grant date | Feb 14, 2012 |
| Priority date | — |
| Expiry date | Dec 14, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided are a substrate supporting unit and a single type substrate polishing apparatus using the substrate supporting unit. During a polishing process, the bottom surface of a substrate is attached to the substrate supporting unit by vacuum suction, and during a post-cleaning process, the substrate is supported by the substrate supporting unit at a position spaced apart from the substrate supporting unit for cleaning the bottom surface of the substrate. Therefore, according to the substrate supporting unit and the substrate polishing apparatus using the substrate supporting unit, in a state where the substrate is supported by the single type substrate supporting unit, a process for polishing the top surface of the substrate and a post-process for cleaning the top and bottom surfaces of the substrate can be sequentially performed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.