Method for producing electronic components

US8114304B2 · kind B2 · utility

Assignee

• Wafer-Level Packaging Portfolio LLC · US

Inventors

• Jürgen Leib · Freising, DE
• Florian Bieck · Singapore, SG

Key dates

• Filing date: Nov 22, 2006
• Grant date: Feb 14, 2012
• Expiry date: May 5, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10F39/806

Abstract

In order to achieve an integration of functional structures into the housing of electronic components, provision is made of a method for producing an electronic component comprising at least one semiconductor element having at least one sensor-technologically active and/or emitting device on at least one side, the method comprising the following steps: provision of at least one die on a wafer, production of at least one patterned support having at least one structure which is functional for the sensor-technologically active and/or emitting device, joining together of the wafer with the at least one support, so that that side of the die which has the sensor-technologically active and/or emitting device faces the support, separation of the die.