Method of manufacturing substrate for liquid discharge head
US8114305B2 · kind B2 · utility
5Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 3, 2008 |
| Grant date | Feb 14, 2012 |
| Priority date | — |
| Expiry date | Nov 1, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1639
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing a silicon substrate for a liquid discharge head with a liquid supply opening formed therein includes: forming one processed portion by laser processing on the substrate from one surface of the substrate; expanding the one processed portion to form a recess portion by performing laser processing at a position which overlaps a part of the one processed portion and does not overlap another part of the one processed portion; and etching from the one surface the substrate with the recess portion formed therein to form the liquid supply opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.