Prepreg and its application products for low thermal expansion and low dielectric tangent
US8115105B2 · kind B2 · utility
4Cited by
1References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2009 |
| Grant date | Feb 14, 2012 |
| Priority date | — |
| Expiry date | Oct 10, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/2475
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A prepreg comprising composite woven cloth or non-woven cloth composed of glass fiber and polyolefin fiber that are a main part of the cloth and a thermosetting resin composition that gives a cured product having a low thermal expansion coefficient, wherein the thermal expansion coefficient of the cured resin composition at 50 to 100° C. is 50 ppm/° C. or less, is disclosed. A printed circuit board, multi layered circuit board, and electronic part are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.