Semiconductor package
US8115291B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2009 |
| Grant date | Feb 14, 2012 |
| Priority date | — |
| Expiry date | May 6, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a semiconductor package including a first substrate including a first substrate pad and a second substrate pad spaced apart from each other, first semiconductor chips stacked on the first substrate and having a first side surface and a second side surface, first chip pads disposed on the first substrate pad and adjacent to the first side surface and provided to the respective first semiconductor chips in the peripheral circuit region and electrically connected to the first substrate pad, and a second semiconductor chip disposed toward the second side surface and including a second chip pad spaced apart from the first chip pad and electrically connected to the second substrate pad, and a heat insulation member provided to the first substrate between the at least one first substrate pad and the at least one second substrate pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.