Sungjun Im
4Patents
1h-index
7Co-inventors
37Inventor score
Filing activity: Jul 31, 2009 → Mar 17, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8115291B2 | Semiconductor package | Electricity | 69 | Active |
| US10636722B2 | System and method to enhance solder joint reliability | Electricity | 0 | Active |
| US11094604B2 | System and method to enhance solder joint reliability | Electricity | 0 | Active |
| US11264301B2 | System and method to enhance reliability in connection with arrangements including circuits | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.