Patent · US Active

Adhesive, method of connecting wiring terminals and wiring structure

US8115322B2 · kind B2 · utility

4Cited by
42References
13Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 2, 2010
Grant dateFeb 14, 2012
Priority date
Expiry dateSep 2, 2030

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/2852
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

This invention provides a wiring-terminal-connecting adhesive comprising a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, and a wiring-terminal-connecting method and a wiring structure which make use of such an adhesive.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.