Semiconductor package and method of forming the same, and printed circuit board
US8116088B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 6, 2008 |
| Grant date | Feb 14, 2012 |
| Priority date | — |
| Expiry date | Dec 13, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided are a semiconductor package, a method of forming the semiconductor package, and a printed circuit board (PCB). The semiconductor package includes: a PCB including at least two parts divided by an isolation region; a semiconductor chip mounted on the PCB; and a molding layer disposed in the isolation region. The method includes: preparing a PCB, the PCB including a plurality of chip regions and a scribe region; forming isolation regions dividing each of the chip regions into two parts, the isolation regions including inner isolation regions and outer isolation regions, the inner isolation regions being provided in the chip regions, the outer isolation regions being provided at both ends of the inner isolation regions so as to extend toward the scribe region; mounting semiconductor chips on the chip regions; and cutting the PCB along the scribe region to divide the chip regions into at least two parts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.