Multiple laser wavelength and pulse width process drilling
US8116341B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 2007 |
| Grant date | Feb 14, 2012 |
| Priority date | — |
| Expiry date | Sep 18, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/108
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Dual-beam laser outputs, preferably derived from a single laser beam, improve the quality of the sidewalls of vias drilled in a target material, such as printed circuit board, comprising fiber-reinforced resin. Two embodiments each use two laser output components to remove a portion of target material from a target material location of a workpiece and rapidly clean remnants of the target material bonded to a metal layer underlying the target material location at a material removal rate. A first embodiment entails directing for incidence on a portion of the target material at the target material location a processing laser output having first and second components characterized by respective first and second wavelengths. A second embodiment entails directing for incidence on a portion of the target material at the target material location a processing laser output having first and second components characterized by respective first and pulse widths.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.