Heating apparatus, substrate processing apparatus, and method of manufacturing semiconductor devices
US8116618B2 · kind B2 · utility
2Cited by
3References
14Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 25, 2008 |
| Grant date | Feb 14, 2012 |
| Priority date | — |
| Expiry date | Dec 15, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67115
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heating apparatus comprises a wall for surrounding and defining a heating space, a heating element mounted on the inner side of the wall, reflecting members for reflecting the heat emitted from the heating element. Also, a moving unit joined to one end of each of the reflecting members for moving the reflecting members. Moreover, pivotal members joined to the reflecting members beside more their respective other side than one side of the reflecting members for controlling as pivots the movement of the reflecting member driven by the moving unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.