Method for holding wafers and device for fixing two parallel arranged wafers relative to one another
US8118290B2 · kind B2 · utility
1Cited by
9References
11Claims
0Family size
Inventor
Key dates
| Filing date | May 16, 2007 |
| Grant date | Feb 21, 2012 |
| Priority date | — |
| Expiry date | Dec 21, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67092
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a device having a first holding instrument (1) for a first wafer (5) and having a second holding instrument (7) for a second wafer (9) arrangeable parallel to the first wafer (5), the two holding instruments (1, 7) being fixable relative to one another. According to the invention, at least one of the holding instruments (1, 7), preferably both holding instruments (1, 7) respectively, comprises at least one gel film (2, 8) for holding the associated wafer (5, 9). The invention furthermore relates to the use of a gel film for holding integral wafers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.