Polishing method, polishing pad, and polishing system
US8118645B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 9, 2009 |
| Grant date | Feb 21, 2012 |
| Priority date | — |
| Expiry date | Jun 15, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/042
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing method, a polishing pad, and a polishing system are described. The polishing pad with a plurality of grooves is provided. The width of each groove is W and the pitch between two adjacent grooves is P. An oscillatory movement distance of a workpiece on the polishing pad is set. The oscillatory movement distance enables any particular point on the workpiece to cross the same number of grooves, when a direction between the particular point and the center of the workpiece is perpendicular to a tangential direction of the grooves. The workpiece is then polished with the oscillatory movement distance, so as to achieve a better polishing uniformity for the surface of the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.