Method of preparing an electrically insulating film and application for the metallization of vias
US8119542B2 · kind B2 · utility
2Cited by
3References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2009 |
| Grant date | Feb 21, 2012 |
| Priority date | — |
| Expiry date | Apr 23, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention essentially relates to a method of preparing an electrically insulating film at the surface of an electrical conductor or semiconductor substrate, such as a silicon substrate.According to the invention, this method comprises:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.