Light-sensing device for multi-spectral imaging
US8120079B2 · kind B2 · utility
21Cited by
3References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 13, 2009 |
| Grant date | Feb 21, 2012 |
| Priority date | — |
| Expiry date | Mar 13, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/803
Abstract
A method of fabricating multi-spectral photo-sensors including photo-diodes incorporating stacked epitaxial superlattices monolithically integrated with CMOS devices on a common semiconductor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.