Patent · US Active

Multi-die memory, apparatus and multi-die memory stack

US8120958B2 · kind B2 · utility

15Cited by

1References

13Claims

0Family size

Assignee

Qimonda AG · DE

Inventors

Christoph Bilger · Munich, DE
Peter Gregorius · Munich, DE
Michael Bruennert · Munich, DE
Maurizio Skerlj · Munich, DE
Wolfgang Walthes · Munich, DE
Johannes Stecker · Birkenfeld, DE
Hermann Ruckerbauer · Radolfzell, DE
Dirk Scheideler · Munich, DE
Roland Barth · Schreiber, CA

Key dates

Filing date	Dec 24, 2007
Grant date	Feb 21, 2012
Priority date	—
Expiry date	Jun 4, 2028

Classification

Technology area (CPC G)Physics
CPC primaryG11C2213/71
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

The multi-die memory comprises a first die and a second die. The first die comprises a first group of memory banks, and the second die comprises a second group of memory banks. The first group of memory banks and the second group of memory banks are coupled to a common memory interface. The common memory interface couples the multi-die memory with an internal connection.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.