Manufacturing method of advanced quad flat non-leaded package
US8124447B2 · kind B2 · utility
15Cited by
114References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2009 |
| Grant date | Feb 28, 2012 |
| Priority date | — |
| Expiry date | Apr 7, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The manufacturing method of advanced quad flat non-leaded packages includes performing a pre-cutting process prior to the backside etching process for defining the contact terminals. The pre-cutting process ensures the isolation of individual contact terminals and improves the package reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.