Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip
US8125068B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 21, 2009 |
| Grant date | Feb 28, 2012 |
| Priority date | — |
| Expiry date | Dec 12, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack thereof, a semiconductor device package thereof, and an electronic apparatus having the same are disclosed. The semiconductor chip comprising, a substrate including an inner semiconductor circuit, a conductive redistribution structure formed on the substrate including a conductive redistribution interconnection and a conductive redistribution via plug, wherein the redistribution via plug is connected to the inner semiconductor circuit; a conductive chip pad formed on the substrate, and a conductive chip via plug configured to penetrate the substrate and electrically connected to the redistribution structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.