Inventor · Seojong-myeon, KR

Jong-Joo Lee

51Patents
8h-index
27Co-inventors
78Inventor score

Filing activity: Apr 20, 2004 → Feb 12, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US7768115B2 Stack chip and stack chip package having the same Electricity 261 Active
US7675181B2 Planar multi semiconductor chip package and method of manufacturing the same Electricity 29 Active
US8471362B2 Three-dimensional stacked structure semiconductor device having through-silicon via and signaling method for the semiconductor device Electricity 20 Active
US7317247B2 Semiconductor package having heat spreader and package stack using the same Electricity 18 Expired
US9391048B2 Semiconductor package Electricity 12 Active
US7462930B2 Stack chip and stack chip package having the same Electricity 9 Active
US7064444B2 Multi-chip ball grid array package Emerging Cross-Sectional Technologies 9 Expired
US7821127B2 Semiconductor device package having buffered memory module and method thereof Emerging Cross-Sectional Technologies 9 Active
US7274097B2 Semiconductor package including redistribution pattern and method of manufacturing the same Electricity 8 Expired
US7745922B2 Package board having internal terminal interconnection and semiconductor package employing the same Electricity 7 Active
US7964948B2 Chip stack, chip stack package, and method of forming chip stack and chip stack package Electricity 6 Active
US8120176B2 Semiconductor device having a conductive bump Electricity 6 Active
US8319351B2 Planar multi semiconductor chip package Electricity 5 Active
US7545037B2 Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same Electricity 4 Active
USRE46666E1 Package board having internal terminal interconnection and semiconductor package employing the same General 3 Active
US8643178B2 Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same Electricity 3 Active
US8125068B2 Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip Electricity 3 Active
US7586182B2 Packaged semiconductor die and manufacturing method thereof Electricity 3 Active
US8884421B2 Multi-chip package and method of manufacturing the same Electricity 3 Active
US8097940B2 Stack package Electricity 3 Active
US8309372B2 Method of manufacturing stacked semiconductor package Electricity 2 Active
US10381334B2 Semiconductor package and method of manufacturing the semiconductor package Electricity 2 Active
US8625938B2 Electronic device having optical communicating part Electricity 2 Active
US8039928B2 Chip stack package Electricity 2 Active
US8633579B2 Multi-chip package and method of manufacturing the same Electricity 2 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.