Patent · US Active

Device including a ring-shaped metal structure and method

US8125072B2 · kind B2 · utility

7Cited by

3References

18Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Rudolf Lachner · Ingolstadt, DE
Josef Boeck · Putzbrunn, DE
Klaus Aufinger · Ottobrunn, DE
Herbert Knapp · Munich, DE

Key dates

Filing date	Aug 13, 2009
Grant date	Feb 28, 2012
Priority date	—
Expiry date	Dec 21, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A device includes a semiconductor chip with a ring-shaped metal structure extending along the contour of a first main surface of the semiconductor chip. An encapsulation body encapsulates the semiconductor chip and defines a second main surface. An array of external contact pads attaches to the second main surface of the encapsulation body, and at least one external contact pad of the array of external contact pads electrically couples to the ring-shaped metal structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.