Exposure apparatus, exposure method, and device manufacturing method
US8125613B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 19, 2007 |
| Grant date | Feb 28, 2012 |
| Priority date | — |
| Expiry date | Dec 21, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70783
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An exposure apparatus includes a projection optical system, which projects a pattern of a mask onto a prescribed exposure area on a substrate at a prescribed projection magnification. The optical axis center of the projection optical system is set to a position different from that of the center of the projection area onto which the pattern is projected. The exposure apparatus further includes a magnification modification device, which modifies the projection magnification of the projection optical system; a calculation device, which calculates a shift length of the center of the projection area associated with modification of the projection magnification; and a correction device, which corrects the position information of the exposure area based on the shift length of the center of the projection area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.