Chemical mechanical polishing with multi-zone slurry delivery
US8128461B1 · kind B1 · utility
7Cited by
10References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2008 |
| Grant date | Mar 6, 2012 |
| Priority date | — |
| Expiry date | Oct 7, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Chemical-mechanical polishing or planarization (CMP) is enhanced with multi-zone slurry delivery. A polishing pad is provided that contacts with the work piece, and a multi-zone platen is displaced proximate to the polishing pad to facilitate slurry delivery. The platen includes multiple fluid distribution layers that each include a fluid-distributing channel extending from a fluid source to a distribution point on layer. The distribution points on each of the fluid distribution layers correspond to different locations on the polishing surface to thereby create multiple fluid-delivery zones on the pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.