Patent · US Active

Semiconductor package and method using isolated VSS plane to accommodate high speed circuitry ground isolation

US8129759B2 · kind B2 · utility

1Cited by

0References

15Claims

0Family size

Assignee

LSI Logic Corporation · US

Inventors

Maurice Othieno · Union City, US
Chok J. Chia · Campbell, US
Amar Amin · Milpitas, US

Key dates

Filing date	Nov 24, 2009
Grant date	Mar 6, 2012
Priority date	—
Expiry date	Nov 24, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate which can have an integrated circuit die attached thereto. The package includes a dedicated high-speed ground plane that is electrically isolated from the ground plane used to ground the low speed circuitry of the package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.