Amar Amin
5Patents
1h-index
8Co-inventors
36Inventor score
Filing activity: Mar 22, 2006 → Oct 4, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7646091B2 | Semiconductor package and method using isolated Vss plane to accommodate high speed circuitry ground isolation | Electricity | 2 | Active |
| US7804167B2 | Wire bond integrated circuit package for high speed I/O | Electricity | 1 | Active |
| US8129759B2 | Semiconductor package and method using isolated VSS plane to accommodate high speed circuitry ground isolation | Electricity | 1 | Active |
| US8049340B2 | Device for avoiding parasitic capacitance in an integrated circuit package | Electricity | 0 | Active |
| US8288269B2 | Methods for avoiding parasitic capacitance in an integrated circuit package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.