Process control method, data registration program, and method for manufacturing electronic device
US8131060B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2007 |
| Grant date | Mar 6, 2012 |
| Priority date | — |
| Expiry date | Dec 15, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49004
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process control method is provided for a surface mount line including a solder printer for printing solder on a surface of a substrate, a solder print inspector for inspecting the printed solder and outputting printing quality data, a mounter for mounting components on the substrate with the solder printed, a mount inspector for inspecting a state of the mounted components and outputting mounting quality data, a reflow furnace for heating the solder to solder the components to the substrate, and a soldering inspector for inspecting a state of the soldering and outputting soldering pass/fail data. The process control method includes: retrieving the printing quality data, the mounting quality data, and the soldering pass/fail data from a primary recorder with the printing quality data, the mounting quality data, and the soldering pass/fail data recorded therein, calculating representative data for each said component from the printing quality data, and recording the representative data, the mounting quality data, and the soldering pass/fail data for each said component in a secondary recorder; and determining whether the solder printer and the mounter need adjustment by using the d…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.