Atomic layer deposition system for coating flexible substrates
US8137464B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2007 |
| Grant date | Mar 20, 2012 |
| Priority date | — |
| Expiry date | Jun 15, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/45551
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Systems and methods for atomic layer deposition (ALD) on a flexible substrate involve guiding the substrate back and forth between spaced-apart first and second precursor zones, so that the substrate transits through each of the precursor zones multiple times. Systems may include a series of turning guides, such as rollers, spaced apart along the precursor zones for supporting the substrate along an undulating transport path. As the substrate traverses back and forth between precursor zones, it passes through a series of flow-restricting passageways of an isolation zone into which an inert gas is injected to inhibit migration of precursor gases out of the precursor zones. Also disclosed are systems and methods for utilizing more than two precursor chemicals and for recycling precursor gases exhausted from the precursor zones.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.