Single-chamber sequential curing of semiconductor wafers
US8137465B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2005 |
| Grant date | Mar 20, 2012 |
| Priority date | — |
| Expiry date | Jun 25, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67115
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to curing of semiconductor wafers. More particularly, the invention relates to cure chambers containing multiple cure stations, each featuring one or more UV light sources. The wafers are cured by sequential exposure to the light sources in each station. In some embodiments, the wafers remain stationary with respect to the light source during exposure. In other embodiments, there is relative movement between the light source and the wafer during exposure. The invention also provides chambers that may be used to independently modulate the cross-linking, density and increase in stress of a cured material by providing independent control of the wafer temperature and UV intensity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.