Method of manufacturing wiring substrate
US8137497B2 · kind B2 · utility
34Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2009 |
| Grant date | Mar 20, 2012 |
| Priority date | — |
| Expiry date | Feb 27, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1469
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes the steps of providing a first tape base material on a single side of a stiffener substrate, forming, on the stiffener substrate, a cavity for accommodating a semiconductor chip therein, inserting the stiffener substrate in the cavity and providing the stiffener substrate on the first tape base material, sealing the semiconductor chip and the stiffener substrate with a sealing resin, and removing the first tape base material and forming a build-up layer on a tape removing surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.